AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors

Shuji Tanaka; Yutaka Honjoya; Masayoshi Esashi

doi:10.1109/MEMSYS.2010.5442459

AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors

Shuji Tanaka, Yutaka Honjoya, Masayoshi Esashi

ENG - Robotics

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

10 Citations (Scopus)

Abstract

Versatile wafer-level vacuum packaging technology using screen-printed AuSn eutectic solder was developed and applied to a SiC diaphragm anticorrosive vacuum sensor. Thin film Ti/SiO₂ "floodgates" were used to prevent melted AuSn solder from flowing into microstructures, e.g. capacitive gaps. After vacuum packaging, a non-evaporable getter (NEG), which chemically absorbs residual gas, was activated by Nd:YAG laser. In comparison to other wafer-level vacuum packaging technologies, the developed one establishes electrical connections and feedthroughs simultaneously, and is tolerant to surface roughness, surface contamination and wafer waviness.

Original language	English
Title of host publication	MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages	492-495
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2010.5442459
Publication status	Published - 2010
Event	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China Duration: 2010 Jan 24 → 2010 Jan 28

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Country/Territory	China
City	Hong Kong
Period	10/1/24 → 10/1/28

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10.1109/MEMSYS.2010.5442459

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Tanaka, S., Honjoya, Y., & Esashi, M. (2010). AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 492-495). Article 5442459 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442459

Tanaka, Shuji ; Honjoya, Yutaka ; Esashi, Masayoshi. / AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors. MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. pp. 492-495 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{bcb68d644fb64102976d2448919a5a9a,

title = "AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors",

abstract = "Versatile wafer-level vacuum packaging technology using screen-printed AuSn eutectic solder was developed and applied to a SiC diaphragm anticorrosive vacuum sensor. Thin film Ti/SiO2 {"}floodgates{"} were used to prevent melted AuSn solder from flowing into microstructures, e.g. capacitive gaps. After vacuum packaging, a non-evaporable getter (NEG), which chemically absorbs residual gas, was activated by Nd:YAG laser. In comparison to other wafer-level vacuum packaging technologies, the developed one establishes electrical connections and feedthroughs simultaneously, and is tolerant to surface roughness, surface contamination and wafer waviness.",

author = "Shuji Tanaka and Yutaka Honjoya and Masayoshi Esashi",

year = "2010",

doi = "10.1109/MEMSYS.2010.5442459",

language = "English",

isbn = "9781424457649",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "492--495",

booktitle = "MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest",

note = "23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 ; Conference date: 24-01-2010 Through 28-01-2010",

}

Tanaka, S, Honjoya, Y & Esashi, M 2010, AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors. in MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest., 5442459, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 492-495, 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010, Hong Kong, China, 10/1/24. https://doi.org/10.1109/MEMSYS.2010.5442459

AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors. / Tanaka, Shuji; Honjoya, Yutaka; Esashi, Masayoshi.
MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. p. 492-495 5442459 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Versatile wafer-level vacuum packaging technology using screen-printed AuSn eutectic solder was developed and applied to a SiC diaphragm anticorrosive vacuum sensor. Thin film Ti/SiO2 "floodgates" were used to prevent melted AuSn solder from flowing into microstructures, e.g. capacitive gaps. After vacuum packaging, a non-evaporable getter (NEG), which chemically absorbs residual gas, was activated by Nd:YAG laser. In comparison to other wafer-level vacuum packaging technologies, the developed one establishes electrical connections and feedthroughs simultaneously, and is tolerant to surface roughness, surface contamination and wafer waviness.

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Tanaka S, Honjoya Y, Esashi M. AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. p. 492-495. 5442459. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2010.5442459

AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors

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