| Original language | English |
|---|---|
| Pages (from-to) | 277-281 |
| Number of pages | 5 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 8 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2005 |
Balance Type Pair Transmission Line for Broadband Using Multi-Layer Substrate
Hiroyuki Nakase, Shoichi Oshima, Takashi Fujii, Suguru Kameda, Yoji Isota, Kazuo Tsubouchi
Research output: Contribution to journal › Article › peer-review