Abstract
Thermal management system which can reject very high amount of heat by small thermal devices will be required for future space systems. Our purpose is to develop miniaturized heat rejection system that can reject more than 100 W/cm2. In the evaporator, thin liquid film vaporization which can dissipate very high heat flux, was utilized. The liquid film is stabilized in micro-channels by capillary forces. The micro-channels are fabricated by chemical etching on silicon and copper plate. Also miniaturized condenser which utilized droplet condensation was tested. Droplets were produced on a cooled plate covered by non-wetting coating. After we built a heat rejection system constructed by above mentioned evaporator and condenser, influence of heat flux, coolant flow rate, and inlet temperature on the temperature of the heater element were investigated. Water is used as working fluid. Heat flux of 100 W/cm2 could be achieved for water inlet temperature in flow rate of 3.0 mL/min. The temperature of the heater element is kept constant at about 120°C.
| Original language | English |
|---|---|
| Pages (from-to) | 30-32 |
| Number of pages | 3 |
| Journal | Microgravity Science and Technology |
| Volume | 19 |
| Issue number | 3-4 |
| DOIs | |
| Publication status | Published - 2007 Jan 1 |
ASJC Scopus subject areas
- Modelling and Simulation
- Engineering(all)
- Physics and Astronomy(all)
- Applied Mathematics