Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons

Takuya Kudo, Zhi Wang, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, first principle calculation based on density functionl theory was applied to graphene nanoribbons (GNRs), which is divided to three groups for the number of carbon dimers, with local large bending deformation so as to reveal the effects of the bending deformation on the electronical properties of GNRs for realizing a GNR-base pressure sensor with high sensitivity and large defomability on a flexible substrate. The mechanism of the change in the band gap is discussed in terms of the change in spatial distributions of state densities. It is clarified that bending defomation causes localization of density state and induces the drastic change of band gap in all groups. Based on the calculation results, it is estimated that GNRs can be alpplied to a pressure sensor and sensitivity is enhanced by increasing the localization of bending deformation. The analyzed result was validated by experiments using a pressure sensor which consisted of GNRs with periodically aligned fine columnar structures. It was confirmed that under the application of compressive stress to the columnar structures caused local large bending deformation of graphene nanoribbons and thus, caused large change of electrical resistance of the deformed graphene ribbons. By increasing the number of columnar in series on a GNR to amplify the local defomation, the sensitivity of the sensor to pressure incresed linearly with the number.

Original languageEnglish
Title of host publicationEMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538656426
DOIs
Publication statusPublished - 2019 Mar 5
Event20th International Conference on Electronic Materials and Packaging, EMAP 2018 - Clear Water Bay, Hong Kong
Duration: 2018 Dec 172018 Dec 20

Publication series

NameEMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

Conference

Conference20th International Conference on Electronic Materials and Packaging, EMAP 2018
Country/TerritoryHong Kong
CityClear Water Bay
Period18/12/1718/12/20

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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