Abstract
Deep reactive ion etching (RIE) was developed not only for silicon but also other materials and silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Key elements of systems such as microactuators to generate a large force and microprobes for future data storage device were described. Packaged micromechanical sensors as pressure sensors and electrostatically levitating micromotors for gyroscopes were developed. Active catheters which move like snakes in blood vessels and sensors for the catheter were studied for the purpose of minimal invasive medicine. Basic problems like Q of resonators and the electrical discharge of electrostatic microactuators were the topics of the research.
Original language | English |
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Pages (from-to) | 6-15 |
Number of pages | 10 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 4180 |
DOIs | |
Publication status | Published - 2000 Dec 1 |
Event | MEMS Reliability for Critical Applications - Santa Clara, CA, USA Duration: 2000 Sept 20 → 2000 Sept 20 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering