TY - JOUR
T1 - Buried interfaces of heat-loaded Mo/Si multilayers studied by soft-x-ray emission spectroscopy
AU - Miyata, N.
AU - Imazono, T.
AU - Ishikawa, S.
AU - Arai, A.
AU - Yanagihara, M.
AU - Watanabe, M.
N1 - Funding Information:
We would like to thank K. Saito for sample preparation. We also thank Y. Harada and M. Watanabe of SPRing-8 for helpful support in measuring SXE spectra. The SXE experiments were carried out under the approval of the Photon Factory Program Advisory Committee (Proposal 99G005). This work was supported in part by the Inoue Foundation for Science. It was also supported in part by the Mitsubishi Foundation.
PY - 2002/4
Y1 - 2002/4
N2 - We measured Si L2,3 soft-x-ray emission spectra from Mo/Si multilayers annealed at 400°C. We showed that MoSi2 was formed at the interface, and the thickness of the MoSi2 interlayer increased with the annealing time. By an analysis of the soft-x-ray emission spectra and the patterns of small-angle x-ray diffraction, we estimated the thickness of the MoSi2 interlayer and a diffusion coefficient between Mo and Si at 400°C as 1.1 (±0.2) × 10-18 cm2/s. We showed that soft-x-ray emission spectroscopy is a useful tool for studying the thermal change of the buried interface nondestructively.
AB - We measured Si L2,3 soft-x-ray emission spectra from Mo/Si multilayers annealed at 400°C. We showed that MoSi2 was formed at the interface, and the thickness of the MoSi2 interlayer increased with the annealing time. By an analysis of the soft-x-ray emission spectra and the patterns of small-angle x-ray diffraction, we estimated the thickness of the MoSi2 interlayer and a diffusion coefficient between Mo and Si at 400°C as 1.1 (±0.2) × 10-18 cm2/s. We showed that soft-x-ray emission spectroscopy is a useful tool for studying the thermal change of the buried interface nondestructively.
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U2 - 10.1142/S0218625X0200283X
DO - 10.1142/S0218625X0200283X
M3 - Article
AN - SCOPUS:0036553507
SN - 0218-625X
VL - 9
SP - 663
EP - 667
JO - Surface Review and Letters
JF - Surface Review and Letters
IS - 2
ER -