TY - GEN
T1 - Capacitive silicon resonator structure with movable electrodes to reduce capacitive gap widths based on electrostatic parallel plate actuation
AU - Van Toan, Nguyen
AU - Ono, Takahito
PY - 2014
Y1 - 2014
N2 - This paper presents the design and fabrication of a capacitive silicon resonator with movable electrodes to obtain smaller capacitive gap widths, which results in smaller motional resistance and lower insertion loss. It also helps to increase the tuning frequency range for the compensation of temperature drift of the silicon resonator. The resonant frequency of the fabricated device with a length of 500 μm, width of 440 μm and thickness of 5 μm is observed at 9.65 MHz, and the quality factor is 49,000. Using electrostatically-drived movable electrode structure, it is shown that the motional resistance is reduced by 200 times, the output signal (insertion loss) is improved by 21 dB and the tuning characteristic of the frequency is 7 times larger than those of the structures without movable electrode structures.
AB - This paper presents the design and fabrication of a capacitive silicon resonator with movable electrodes to obtain smaller capacitive gap widths, which results in smaller motional resistance and lower insertion loss. It also helps to increase the tuning frequency range for the compensation of temperature drift of the silicon resonator. The resonant frequency of the fabricated device with a length of 500 μm, width of 440 μm and thickness of 5 μm is observed at 9.65 MHz, and the quality factor is 49,000. Using electrostatically-drived movable electrode structure, it is shown that the motional resistance is reduced by 200 times, the output signal (insertion loss) is improved by 21 dB and the tuning characteristic of the frequency is 7 times larger than those of the structures without movable electrode structures.
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U2 - 10.1109/MEMSYS.2014.6765874
DO - 10.1109/MEMSYS.2014.6765874
M3 - Conference contribution
AN - SCOPUS:84898956740
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1245
EP - 1248
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -