TY - GEN
T1 - Capacitive silicon resonators with piezoresistive heat engines
AU - Van Toan, Nguyen
AU - Van Nha, Nguyen
AU - Ono, Takahito
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/26
Y1 - 2017/7/26
N2 - This work reports on capacitive silicon resonators with piezoresistive heat engines. The resonant body is divided into many parts which are connected each other by small piezoresistive beams to enhance the electromechanical transduction using a piezo-resistive heat engine effect. The capacitive silicon resonators with single (device #1) and multiple (device #2) piezoresistive beams have been designed and fabricated. With bias current (7 V voltage source) passing through the resonant body, the insertion loss of the fabricated devices is increased by 10 dB and 20 dB for device #1 and device #2, respectively, in comparison with the capacitive silicon resonators without the power to the piezoresistive heat engine. In addition, the motional resistance of device #1 and #2 are reduced by 70% and 90%, respectively.
AB - This work reports on capacitive silicon resonators with piezoresistive heat engines. The resonant body is divided into many parts which are connected each other by small piezoresistive beams to enhance the electromechanical transduction using a piezo-resistive heat engine effect. The capacitive silicon resonators with single (device #1) and multiple (device #2) piezoresistive beams have been designed and fabricated. With bias current (7 V voltage source) passing through the resonant body, the insertion loss of the fabricated devices is increased by 10 dB and 20 dB for device #1 and device #2, respectively, in comparison with the capacitive silicon resonators without the power to the piezoresistive heat engine. In addition, the motional resistance of device #1 and #2 are reduced by 70% and 90%, respectively.
UR - http://www.scopus.com/inward/record.url?scp=85029387262&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85029387262&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2017.7994085
DO - 10.1109/TRANSDUCERS.2017.7994085
M3 - Conference contribution
AN - SCOPUS:85029387262
T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
SP - 456
EP - 459
BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Y2 - 18 June 2017 through 22 June 2017
ER -