TY - GEN
T1 - Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies
AU - Fukushima, Takafumi
N1 - Funding Information:
This work was performed in the Micro/Nano-machining research and education Center (MNC), Jun-ichi Nishizawa Research Center, and Global INTegration Initiative (GINTI) in Tohoku University.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/10/3
Y1 - 2018/10/3
N2 - We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, 'non-transfer stacking', in other word, flip-chip self-assembly and 'transfer stacking' called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.
AB - We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, 'non-transfer stacking', in other word, flip-chip self-assembly and 'transfer stacking' called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.
KW - 3D and heterogeneous system integration
KW - chip-to-wafer bonding
KW - massively parallel capillary self-assembly
UR - http://www.scopus.com/inward/record.url?scp=85056183360&partnerID=8YFLogxK
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U2 - 10.1109/MARSS.2018.8481147
DO - 10.1109/MARSS.2018.8481147
M3 - Conference contribution
AN - SCOPUS:85056183360
T3 - MARSS 2018 - International Conference on Manipulation, Automation and Robotics at Small Scales
BT - MARSS 2018 - International Conference on Manipulation, Automation and Robotics at Small Scales
A2 - Fatikow, Sergej
A2 - Haliyo, Sinan
A2 - Arai, Fumihito
A2 - Sill, Albert
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Manipulation, Automation and Robotics at Small Scales, MARSS 2018
Y2 - 4 July 2018 through 8 July 2018
ER -