@inproceedings{52d070112f194cbdab8c9dd791907b3f,
title = "Characterization of eutectic wafer bonding using Gold and Silicon",
author = "Lin, {Yu Ching} and Mario Baum and Marco Haubold and J{\"o}rg Fr{\"o}mel and Maik Wiemer and Thomas Gessner and Masayoshi Esashi",
year = "2009",
language = "English",
series = "Smart Systems Integration 2009, SSI 2009",
publisher = "AKA Verlag",
pages = "56--63",
booktitle = "Smart Systems Integration 2009, SSI 2009",
note = "Smart Systems Integration Conference 2009, SSI 2009 ; Conference date: 10-03-2009 Through 11-03-2009",
}