Abstract
Characterization of the bonding interfaces among particles of Al powder compacts prepared by pulse electric current sintering (PECS) process was investigated by means of scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). The direct metal- to-metal bonding interfaces and the metal-to-oxide film layer-to-metal bonding interfaces were observed in Al powder compacts. The fraction of the direct metal-to-metal bonding interfaces in the powder compacts increased with increasing in sintering temperature or loading pressure. The oxide film covered at Al powder particles surface was broken and dispersed by plastic deformation of powder particles under loading pressure. Increasing in sintering temperature or loading pressure, the breakdown of oxide film was promoted.
| Original language | English |
|---|---|
| Pages (from-to) | 97-102 |
| Number of pages | 6 |
| Journal | Materials Science Forum |
| Volume | 423-425 |
| DOIs | |
| Publication status | Published - 2003 |
| Event | Proceedings of the Seventh International Symposium on Functionally Graded Materials - Beijing, China Duration: 2002 Oct 15 → 2002 Oct 18 |
Keywords
- Aluminum
- Bonding interface
- Oxide film
- Powder compact
- Pulse electric current sintering
- Transmission electron microscopy
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering