Abstract
The impact of TiN deposition on thin high-k (HfO2 and HfSiON) films formed on Si substrates was studied using monoenergetic positron beams. For the predeposition sample, the positrons implanted into Si diffuse toward the high-k/Si interface under the influence of the electric field, suggesting the presence of negative charges in the high-k films. After TiN was deposited on HfO2, positive charges were introduced at the TiN/HfO2 interface, which were associated with the incorporation of nitride into HfO 2, resulting in the formation of positively charged oxygen vacancies (Vos). From the isochronal annealing experiments for TiN/HfSiON/Si, it was found that positively charged defects (such as Vo) were introduced into HfSiON after annealing at 700-900°C. These defects were introduced by the interaction between TiN and HfSiON, resulting in the formation of polycrystalline TiO2 at the interface. The positively charged defects were annealed out at 1100°C, but the dielectric properties of HfSiON degraded.
Original language | English |
---|---|
Pages (from-to) | 3214-3218 |
Number of pages | 5 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 46 |
Issue number | 5 B |
DOIs | |
Publication status | Published - 2007 May 17 |
Externally published | Yes |
Keywords
- Defects
- HfO
- HfSiON
- High-k
- Metal gate
- Positron annihilation
- TiN
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)