Abstract
This letter reports a novel chip-level microassembly technology to construct an XYZ-microstage with large displacements into X-, Y-, Z-directions. The main parts of the XYZ-microstage, consisting of a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate, are assembled together by using micro manipulators. Small conductive mechanical springs are used to realize the electrical connections between XY-microstage and Z-microstages. It is demonstrated that the fabricated XYZ-microstage based on microassembly technology can achieve displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction, respectively.
| Original language | English |
|---|---|
| Pages (from-to) | 236-237 |
| Number of pages | 2 |
| Journal | IEEJ Transactions on Sensors and Micromachines |
| Volume | 135 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2015 Jun 1 |
Keywords
- Chip-level microassembly technology
- Electrical connections
- Large displacements
- XYZ-microstage
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering