Chip-level microassembly of XYZ-microstage with large displacements

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6 Citations (Scopus)


This letter reports a novel chip-level microassembly technology to construct an XYZ-microstage with large displacements into X-, Y-, Z-directions. The main parts of the XYZ-microstage, consisting of a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate, are assembled together by using micro manipulators. Small conductive mechanical springs are used to realize the electrical connections between XY-microstage and Z-microstages. It is demonstrated that the fabricated XYZ-microstage based on microassembly technology can achieve displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction, respectively.

Original languageEnglish
Pages (from-to)236-237
Number of pages2
JournalIEEJ Transactions on Sensors and Micromachines
Issue number6
Publication statusPublished - 2015 Jun 1


  • Chip-level microassembly technology
  • Electrical connections
  • Large displacements
  • XYZ-microstage

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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