Cladding technique for development of Ag-In-Cd decoupler

M. Teshigawara, M. Harada, S. Saito, K. Kikuchi, H. Kogawa, Y. Ikeda, M. Kawai, H. Kurishita, K. Konashi

Research output: Contribution to journalConference articlepeer-review

11 Citations (Scopus)


To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.

Original languageEnglish
Pages (from-to)154-162
Number of pages9
JournalJournal of Nuclear Materials
Issue number1-3
Publication statusPublished - 2005 Aug 1
EventProceedings of the 6th International Workshop on Spallation Materials Technology IWSMT-6 -
Duration: 2003 Nov 302003 Dec 5


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