Abstract
Cointegration of titanium nitride (TiN)-gate high-performance tied-gate three-terminal FinFETs with symmetric gate-oxide thicknesses (tox1= tox2= 1.7 nm) and variable threshold-voltage Vth independent-gate four-terminal (4T) FinFETs with asymmetric gate-oxide thicknesses (Tox1 = 1.7 nm for the driving-gate-oxide, and (tox2 = 3.4 or 7.0 nm for the control-gate-oxide) has been successfully developed using conventional reactive sputtering, two-step Si-fin and gate-oxide formation, and resist etch-back processes. A significantly improved subthreshold slope and an extremely low OFF-state current Ioff are experimentally confirmed in the asymmetric gate-oxide thickness 4T FinFETs by increasing the control-gate-oxide thickness to twice or more the driving-gate-oxide thickness. The developed techniques are attractive for high-performance and low-power FinFET very large-scale integration circuits.
Original language | English |
---|---|
Pages (from-to) | 517-519 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 28 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2007 Jun |
Externally published | Yes |
Keywords
- Asymmetric gate-oxide thicknesses
- Cointegration
- Double-gate MOSFET
- FinFET
- Independent-gate FinFET
- Threshold-voltage control
- TiN gate
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering