Compact and high rigidity structure of slit type wire bonder ultrasonic transducer

Kohei Seyama, Osamu Kakutani, Shigetoshi Sugawa

Research output: Contribution to journalArticlepeer-review


Ultrasonic Transducer in the wire bonding machine is a key component to determine its bonding speed, and is demanded to be downsized with keeping high rigidity performance for high-speed bonding process. In this paper, a modeling of the ultrasonic transducer vibration and a new ultrasonic transducer with slit structure near the fixation parts is discussed. The piezoelectric element designed by an analytical model has 45% lighter weight than the conventional one. The slit type ultrasonic transducer newly proposed and simulation by finite element method has 66% lighter weight and 2.44-times higher rigidity than the conventional one. As a result, the slit type ultrasonic transducer enable 200G acceleration motion at Z direction of wire bonder from 160G by previous one and it shorten 33% of rising ultrasonic vibration time. Finally, it makes 17% faster cycle time to make wire, it has a potential to improve productivity a lot.

Original languageEnglish
Pages (from-to)176-181
Number of pages6
JournalJournal of the Japan Society for Precision Engineering
Issue number2
Publication statusPublished - 2019


  • Slit type wire bonder ultrasonic transducer
  • Ultrasonic vibration
  • Wire bonding


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