Compact triangulation sensor array constructed by wafer bending

Satoshi Endou, Masahiro Ishimori, Minoru Sasaki, Kazuhiro Hane

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


An optical triangulation distance sensor array was constructed by bending a silicon wafer. Since bending is the final process in the fabrication sequence, planar photolithography can be included in the fabrication sequence. The elements on the Si wafer are all prealigned under a planar condition, and the position-sensitive detector, mirror, and alignment pit for the collimation ball lens are prepared before bending the wafer. The size of the optical bench produced by the sensor substrate is 1.4 mm deep. By batch fabrication, a 2 × 2 sensor array was produced. A dynamic range of 4 mm and a noise level of ±1 % was confirmed by testing.

Original languageEnglish
Pages (from-to)2874-2878
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Issue number4 B
Publication statusPublished - 2005 Apr


  • Optical metrology
  • Prealignment
  • Three-dimensional structure
  • Triangulation distance sensor
  • Wafer bending

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)


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