Compact triangulation sensor realized by bending Si wafer with optical elements at metal hinges

Minora Sasaki, Satoshi Endou, Kazuhiro Hane

Research output: Contribution to journalArticlepeer-review

Abstract

A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.

Original languageEnglish
Pages (from-to)271-276+3
JournalIEEJ Transactions on Sensors and Micromachines
Volume128
Issue number6
DOIs
Publication statusPublished - 2008

Keywords

  • Optical integration
  • Prealignment
  • Three-dimensional structure
  • Triangulation distance sensor
  • Wafer-bending

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