Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches

Jiromaru Tsujino; Noboru Shimada; Yasunori Saotome; Eiichi Sugimoto

doi:10.1109/ULTSYM.2009.5441788

Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches

Jiromaru Tsujino, Noboru Shimada, Yasunori Saotome, Eiichi Sugimoto

Institute for Materials Research (IMR)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Abstract

20 kHz ultrasonic vibration compacting system with 15-mm-diameter upper and lower vibration punches and a radial vibration die, and 20 kHz vibration compacting system using 5-mm-diameter upper and lower vibration punches are studied. Compacting of metal, alloy and ceramics powder is important process for powder metallurgy which is used for producing small and precise mechanical parts and required for various industry fields including electronics. Some complex metal alloy, amorphous alloy and fine ceramic powder such as zirconium are impossible to compact using only static pressure. Various powder are compacted with larger density and more uniform distribution compared that without vibration.

Original language	English
Title of host publication	2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1985-1988
Number of pages	4
ISBN (Print)	9781424443895
DOIs	https://doi.org/10.1109/ULTSYM.2009.5441788
Publication status	Published - 2009
Event	2009 IEEE International Ultrasonics Symposium, IUS 2009 - Rome, Italy Duration: 2009 Sept 20 → 2009 Sept 23

Publication series

Name	Proceedings - IEEE Ultrasonics Symposium
ISSN (Print)	1051-0117

Other

Other	2009 IEEE International Ultrasonics Symposium, IUS 2009
Country/Territory	Italy
City	Rome
Period	09/9/20 → 09/9/23

Keywords

15-mm-diameter vibration compacting system
20 kHz compacting system: vibration punch
5-mm-diameter vibration compacting system
Ultrasonic vibration compacting of various powder
Various vibration die

ASJC Scopus subject areas

Acoustics and Ultrasonics

Access to Document

10.1109/ULTSYM.2009.5441788

Cite this

Tsujino, J., Shimada, N., Saotome, Y., & Sugimoto, E. (2009). Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches. In 2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009 (pp. 1985-1988). [5441788] (Proceedings - IEEE Ultrasonics Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ULTSYM.2009.5441788

Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches. / Tsujino, Jiromaru; Shimada, Noboru; Saotome, Yasunori et al.

2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009. Institute of Electrical and Electronics Engineers Inc., 2009. p. 1985-1988 5441788 (Proceedings - IEEE Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Tsujino, J, Shimada, N, Saotome, Y & Sugimoto, E 2009, Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches. in 2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009., 5441788, Proceedings - IEEE Ultrasonics Symposium, Institute of Electrical and Electronics Engineers Inc., pp. 1985-1988, 2009 IEEE International Ultrasonics Symposium, IUS 2009, Rome, Italy, 09/9/20. https://doi.org/10.1109/ULTSYM.2009.5441788

Tsujino J, Shimada N, Saotome Y, Sugimoto E. Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches. In 2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009. Institute of Electrical and Electronics Engineers Inc. 2009. p. 1985-1988. 5441788. (Proceedings - IEEE Ultrasonics Symposium). doi: 10.1109/ULTSYM.2009.5441788

Tsujino, Jiromaru ; Shimada, Noboru ; Saotome, Yasunori et al. / Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches. 2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009. Institute of Electrical and Electronics Engineers Inc., 2009. pp. 1985-1988 (Proceedings - IEEE Ultrasonics Symposium).

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abstract = "20 kHz ultrasonic vibration compacting system with 15-mm-diameter upper and lower vibration punches and a radial vibration die, and 20 kHz vibration compacting system using 5-mm-diameter upper and lower vibration punches are studied. Compacting of metal, alloy and ceramics powder is important process for powder metallurgy which is used for producing small and precise mechanical parts and required for various industry fields including electronics. Some complex metal alloy, amorphous alloy and fine ceramic powder such as zirconium are impossible to compact using only static pressure. Various powder are compacted with larger density and more uniform distribution compared that without vibration.",

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Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches

Abstract

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Keywords

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