TY - GEN
T1 - Comparative study on effective electron mobility in FinFETs with a (111) channel surface fabricated by wet and dry etching processes
AU - Liu, Y. X.
AU - Sugimata, E.
AU - Masahara, M.
AU - Ishii, K.
AU - Endo, K.
AU - Matsukawa, T.
AU - Yamauchi, H.
AU - Suzuki, E.
PY - 2005/1/1
Y1 - 2005/1/1
N2 - The quantitative comparison of the electron mobility (ueff) in the poly-Si gated n-channel multi-FinFETs fabricated by the orientation- dependent wet etching and conventional RIE processes has been carried out. A remarkable increment in Ueff has experimentally been confirmed in the Si-fin channels fabricated by the wet etching instead of the RIE. Therefore, it is concluded that the developed wet etching technique is very attractive for the fabrication process of the high quality and ultra-thin Si-fin channel FinFETs.
AB - The quantitative comparison of the electron mobility (ueff) in the poly-Si gated n-channel multi-FinFETs fabricated by the orientation- dependent wet etching and conventional RIE processes has been carried out. A remarkable increment in Ueff has experimentally been confirmed in the Si-fin channels fabricated by the wet etching instead of the RIE. Therefore, it is concluded that the developed wet etching technique is very attractive for the fabrication process of the high quality and ultra-thin Si-fin channel FinFETs.
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U2 - 10.1109/imnc.2005.203839
DO - 10.1109/imnc.2005.203839
M3 - Conference contribution
AN - SCOPUS:33847180209
SN - 4990247221
SN - 9784990247225
T3 - Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference
SP - 264
EP - 265
BT - Digest of Papers - Microprocesses and Nanotechnology 2005
PB - IEEE Computer Society
T2 - 2005 International Microprocesses and Nanotechnology Conference
Y2 - 25 October 2005 through 28 October 2005
ER -