TY - GEN
T1 - Comparison of three methods to measure the internal pressure of empty MEMS packages
AU - Wang, B.
AU - Tanaka, S.
AU - De Coster, J.
AU - Severi, S.
AU - Witvrouw, A.
AU - Wevers, M.
AU - De Wolf, I.
PY - 2012
Y1 - 2012
N2 - Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.
AB - Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.
UR - http://www.scopus.com/inward/record.url?scp=84869047544&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84869047544&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2012.6306268
DO - 10.1109/IPFA.2012.6306268
M3 - Conference contribution
AN - SCOPUS:84869047544
SN - 9781467309806
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
T2 - 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
Y2 - 2 July 2012 through 6 July 2012
ER -