TY - GEN
T1 - Comprehensive study on wafer-level vacuum packaging using anodically-bondable LTCC wafer and thin film getter
AU - Tanaka, Shuji
AU - Fukushi, Hideyuki
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/5
Y1 - 2015/8/5
N2 - An anodically-bondable low-temperature cofired ceramic (LTCC) wafer is a new wafer-level packaging material for micro electro mechanical systems (MEMS). It provides 3-dimensional metal interconnection inside, and enables hermetic sealing, which was guaranteed by automobile-grade thermal cycling tests. In this study, the sealing pressure was first investigated under various anodic bonding conditions with and without two types of thin film getter (PaGe getter, Saes Getters or Ti getter). The vacuum sealing pressure was a few kPa or even higher, and more importantly, often different for each sample without the thin film getter. On the other hand, samples with the getter always exhibited good vacuum level, which was below the detection limit (80 Pa) of zero-balance method using a Si diaphragm. Typical process conditions for borosilicate glass on commercially-available bonding tools work well.
AB - An anodically-bondable low-temperature cofired ceramic (LTCC) wafer is a new wafer-level packaging material for micro electro mechanical systems (MEMS). It provides 3-dimensional metal interconnection inside, and enables hermetic sealing, which was guaranteed by automobile-grade thermal cycling tests. In this study, the sealing pressure was first investigated under various anodic bonding conditions with and without two types of thin film getter (PaGe getter, Saes Getters or Ti getter). The vacuum sealing pressure was a few kPa or even higher, and more importantly, often different for each sample without the thin film getter. On the other hand, samples with the getter always exhibited good vacuum level, which was below the detection limit (80 Pa) of zero-balance method using a Si diaphragm. Typical process conditions for borosilicate glass on commercially-available bonding tools work well.
KW - Anodic bonding
KW - Low temperature cofired ceramics (LTCC)
KW - Thin film getter
KW - Vacuum sealing
KW - Wafer-level packaging
UR - http://www.scopus.com/inward/record.url?scp=84955488811&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84955488811&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2015.7180962
DO - 10.1109/TRANSDUCERS.2015.7180962
M3 - Conference contribution
AN - SCOPUS:84955488811
T3 - 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
SP - 468
EP - 471
BT - 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
Y2 - 21 June 2015 through 25 June 2015
ER -