Conductive polymer/metal composites for interconnect of flexible devices

Jin Kawakita, Yasuo Hashimoto Shinoda, Takanori Shuto, Toyohiro Chikyow

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70μm within 10 min. The conductivity of the composite was improved to 6.0 × 102Ω From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices.

Original languageEnglish
Article number06FJ12
JournalJapanese journal of applied physics
Issue number6
Publication statusPublished - 2015 Jun 1
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)


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