Conformal coating of poly-glycidyl methacrylate as lithographic polymer via initiated chemical vapor deposition

Shinya Yoshida, Tatsuya Kobayashi, Masafumi Kumano, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


This study reports on the investigation of the potential applicability of poly-glycidyl methacrylate (PGMA) films deposited via initiated chemical vapor deposition (i-CVD) as lithographic resists in the microfabrication of non-planar structures. We investigate the appropriate deposition conditions of i-CVD required to form PGMA films with smooth surfaces. As a result, under the optimal conditions determined by us, we fabricate films with nanometer-scale flat surfaces. Subsequently, we demonstrate that i-CVD is effective for conformally coating a high-aspect-ratio Si trench with PGMA film via our deposition experiments. In our deep-ultraviolet lithography experiment, we successfully fabricate a fine 20-m line-and-space (L/S) pattern with a height of approximately 1 m. Furthermore, in our electron-beam (EB) lithography experiment, we define a fine 350-nm L/S pattern with a height of 120nm. In addition, the i-CVD process can be used to form highly-sensitive EB resist films; the lowest dose amount for patterning these films is evaluated to be less than 0.01 C/cm2. Our results demonstrate that i-CVD is a potentially powerful method to conformally coat lithographic resist films on three-dimensional structures.

Original languageEnglish
Article number023001
JournalJournal of Micro/Nanolithography, MEMS, and MOEMS
Issue number2
Publication statusPublished - 2012


  • conformal coating
  • deep-ultraviolet lithography
  • e-beam lithography
  • initiated chemical vapor deposition
  • poly-glycidyl methacrylate
  • resist coating technology

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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