TY - GEN
T1 - Connection of 48 sensors on the same serial bus line for human-inspired event-driven tactile sensation covering wide spatial range over 2 meters at millimeter resolution
AU - Shao, C.
AU - Asano, S.
AU - Muroyama, M.
AU - Nakayama, T.
AU - Hata, Y.
AU - Tanaka, S.
N1 - Funding Information:
Tohoku University was partly supported by the project of ³'HYHORSPHQW RI WKH Key Technologies for the Next-Generation Artificial Intelligence/Robots´ organized by New Energy and Industrial Technology Development Organization (NEDO). The sensor platform LSI was developed in the program of ³Formation of Innovation &HQWHU IRU )XVLRQ RI $GYDQFHG 7HFKQRORJLHV´ organized by the Ministry of Education, Culture, Sports, Science and Technology.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - This work is a part of the project which develops a bus-network tactile sensing system for covering a wide area of robots at high spatial resolution. 48 sensor nodes with a capacitive 1-axis force sensor for each were installed on the same bus line with a length of 2.4 m, and every sensor was operated asynchronously in event-driven mode. Data packet from each sensor was received correctly and almost evenly, when 8 sensors were stimulated at the same time. Because the sensor node used in this study is compatible with an integrated tactile sensor with 2.7 mm square footprint, this system is adapted to wide coverage and high spatial resolution of sensors by just changing the design of the bus.
AB - This work is a part of the project which develops a bus-network tactile sensing system for covering a wide area of robots at high spatial resolution. 48 sensor nodes with a capacitive 1-axis force sensor for each were installed on the same bus line with a length of 2.4 m, and every sensor was operated asynchronously in event-driven mode. Data packet from each sensor was received correctly and almost evenly, when 8 sensors were stimulated at the same time. Because the sensor node used in this study is compatible with an integrated tactile sensor with 2.7 mm square footprint, this system is adapted to wide coverage and high spatial resolution of sensors by just changing the design of the bus.
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U2 - 10.1109/MEMSYS.2018.8346693
DO - 10.1109/MEMSYS.2018.8346693
M3 - Conference contribution
AN - SCOPUS:85046993805
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 866
EP - 869
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -