Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Tetsu Ichitsubo; Eiichiro Matsubara; Kozo Fujiwara; Masahiko Yamaguchi; Hisao Irie; Seishi Kumamoto; Takaaki Anada

doi:10.1016/j.jallcom.2004.09.043

Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Tetsu Ichitsubo, Eiichiro Matsubara, Kozo Fujiwara, Masahiko Yamaguchi, Hisao Irie, Seishi Kumamoto, Takaaki Anada

Research output: Contribution to journal › Article › peer-review

55 Citations (Scopus)

Abstract

Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn₉₁Zn₉)_99.98-xM_xAl_0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu₅Zn₈ and Sn₆Cu₅, are found to be significantly restrained.

Original language	English
Pages (from-to)	200-205
Number of pages	6
Journal	Journal of Alloys and Compounds
Volume	392
Issue number	1-2
DOIs	https://doi.org/10.1016/j.jallcom.2004.09.043
Publication status	Published - 2005 Apr 19

Keywords

Casting
Metals (Pb-free solder alloys)
Thermal analysis
X-ray
X-ray diffraction

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10.1016/j.jallcom.2004.09.043

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@article{3c7055f161dd4874b4b061b69fa01042,

title = "Control of compound forming reaction at the interface between SnZn solder and Cu substrate",

abstract = "Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98-xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.",

keywords = "Casting, Metals (Pb-free solder alloys), Thermal analysis, X-ray, X-ray diffraction",

author = "Tetsu Ichitsubo and Eiichiro Matsubara and Kozo Fujiwara and Masahiko Yamaguchi and Hisao Irie and Seishi Kumamoto and Takaaki Anada",

note = "Funding Information: This work was partly supported by Shorai Foundation for Science and Technology.",

year = "2005",

month = apr,

day = "19",

doi = "10.1016/j.jallcom.2004.09.043",

language = "English",

volume = "392",

pages = "200--205",

journal = "Journal of Alloys and Compounds",

issn = "0925-8388",

publisher = "Elsevier BV",

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T1 - Control of compound forming reaction at the interface between SnZn solder and Cu substrate

AU - Ichitsubo, Tetsu

AU - Matsubara, Eiichiro

AU - Fujiwara, Kozo

AU - Yamaguchi, Masahiko

AU - Irie, Hisao

AU - Kumamoto, Seishi

AU - Anada, Takaaki

N1 - Funding Information: This work was partly supported by Shorai Foundation for Science and Technology.

PY - 2005/4/19

Y1 - 2005/4/19

N2 - Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98-xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.

AB - Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98-xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.

KW - Casting

KW - Metals (Pb-free solder alloys)

KW - Thermal analysis

KW - X-ray

KW - X-ray diffraction

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U2 - 10.1016/j.jallcom.2004.09.043

DO - 10.1016/j.jallcom.2004.09.043

M3 - Article

AN - SCOPUS:15544386515

SN - 0925-8388

VL - 392

SP - 200

EP - 205

JO - Journal of Alloys and Compounds

JF - Journal of Alloys and Compounds

IS - 1-2

ER -

Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Abstract

Keywords

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