Abstract
The precipitation behavior of Cu-rich precipitates in Cu-implanted Fe films has been studied using transmission electron microscopy and electron diffraction. The results show that micro-twins which lie parallel to a (112)bcc plane as well as spherical copper particles with diameter less than 5 nm are observed in the as-implanted specimens. Upon thermal ageing, the precipitation in the Cu-implanted Fe films proceeds more rapidly than it does in the corresponding Fe-Cu alloys, and large copper precipitates are observed to grow near the micro-twins.
Original language | English |
---|---|
Pages (from-to) | 74-77 |
Number of pages | 4 |
Journal | Surface and Coatings Technology |
Volume | 83 |
Issue number | 1-3 |
DOIs | |
Publication status | Published - 1996 Sept |
Keywords
- Cu implantation
- Cu precipitation
- Electron microscopy
- Fe-Cu alloy