TY - GEN
T1 - Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections
AU - Suzuki, Ken
AU - Mizuno, Ryota
AU - Nakoshi, Yutaro
AU - Miura, Hideo
N1 - Funding Information:
ACKNOWLEDGMENT This research activity has been supported partially by Japanese special coordination funds for promoting science and technology, Japanese Grants-in-aid for Scientific Research, and Tohoku University. This research was supported partly by JSPS KAKENHI Grant Number JP16H06357.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - In this study, the effect of crystallinity of grain and grain boundaries in electroplated gold thin-film interconnections on their electromigation (EM) resistance was investigated experimentally. The activation energy in Black's equation was evaluated by accelerated EM test and Arrhenius plot as a function of the crystallinity of the interconnection. The activation energy in the electroplated gold thin-film interconnection was increased from 0.54 to 0.61 eV by improving the crystallinity due to the annealing at 400°C after electroplating. The lifetime of the interconnection was estimated by using the evaluated activation energy. The estimated result showed that the lifetime of the interconnection annealed at 400°C was about 20 times longer than that of as-electroplated interconnection. Therefore, the control of the crystallinity is indispensable for improving the reliability of electronic devices.
AB - In this study, the effect of crystallinity of grain and grain boundaries in electroplated gold thin-film interconnections on their electromigation (EM) resistance was investigated experimentally. The activation energy in Black's equation was evaluated by accelerated EM test and Arrhenius plot as a function of the crystallinity of the interconnection. The activation energy in the electroplated gold thin-film interconnection was increased from 0.54 to 0.61 eV by improving the crystallinity due to the annealing at 400°C after electroplating. The lifetime of the interconnection was estimated by using the evaluated activation energy. The estimated result showed that the lifetime of the interconnection annealed at 400°C was about 20 times longer than that of as-electroplated interconnection. Therefore, the control of the crystallinity is indispensable for improving the reliability of electronic devices.
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U2 - 10.1109/3DIC48104.2019.9058897
DO - 10.1109/3DIC48104.2019.9058897
M3 - Conference contribution
AN - SCOPUS:85084115884
T3 - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
BT - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Y2 - 8 October 2019 through 10 October 2019
ER -