TY - JOUR
T1 - Cyanide-free displacement silver plating using highly concentrated aqueous solutions of metal chloride salts
AU - Adachi, Ken
AU - Kitada, Atushi
AU - Fukami, Kazuhiro
AU - Murase, Kuniaki
N1 - Funding Information:
This work was supported financially by Grants-in-Aid for Scientific Research (B) (No. 19H02490: A. K.) from the Japan Society for the Promotion of Science (JSPS).
Publisher Copyright:
© The Author(s) 2019.
PY - 2019
Y1 - 2019
N2 - We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl–; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties.
AB - We report a novel, cyanide-free, and low-cost displacement silver (Ag) plating bath, i.e., AgCl-dissolved highly concentrated CaCl2/LiCl aqueous solution. Compared to dilute CaCl2/LiCl solutions, this aqueous solution exhibited much higher AgCl solubility because of the high activity of Cl–; the maximum AgCl solubility was achieved at 44.4 mmol dm–3 (i.e., [Ag(I)] = 8.07 g kg−1 H2O). Smooth Ag deposits with a lusterless gray-colored appearance were successfully obtained by displacement plating on a Cu substrate. The mechanism of smooth Ag plating is discussed in terms of its electrochemical and diffusive properties.
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U2 - 10.1149/2.0871910jes
DO - 10.1149/2.0871910jes
M3 - Article
AN - SCOPUS:85073202982
SN - 0013-4651
VL - 166
SP - D409-D414
JO - Journal of the Electrochemical Society
JF - Journal of the Electrochemical Society
IS - 10
ER -
