Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation

Y. Izawa; S. Tanaka; H. Kikuchi; Y. Tsurumi; N. Miyanaga; M. Esashi; M. Fujita

doi:10.1109/MEMSYS.2008.4443783

Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation

Y. Izawa, S. Tanaka, H. Kikuchi, Y. Tsurumi, N. Miyanaga, M. Esashi, M. Fujita

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

14 Citations (Scopus)

Abstract

We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO₂ laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide of separation, and the processed wafer was diced with low stress. The diced lines completely followed the internal transformation.

Original language	English
Title of host publication	MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages	822-827
Number of pages	6
DOIs	https://doi.org/10.1109/MEMSYS.2008.4443783
Publication status	Published - 2008
Event	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States Duration: 2008 Jan 13 → 2008 Jan 17

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
Country/Territory	United States
City	Tucson, AZ
Period	08/1/13 → 08/1/17

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10.1109/MEMSYS.2008.4443783

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Izawa, Y., Tanaka, S., Kikuchi, H., Tsurumi, Y., Miyanaga, N., Esashi, M., & Fujita, M. (2008). Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 822-827). Article 4443783 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443783

Izawa, Y. ; Tanaka, S. ; Kikuchi, H. et al. / Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation. MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. pp. 822-827 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation",

abstract = "We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide of separation, and the processed wafer was diced with low stress. The diced lines completely followed the internal transformation.",

author = "Y. Izawa and S. Tanaka and H. Kikuchi and Y. Tsurumi and N. Miyanaga and M. Esashi and M. Fujita",

year = "2008",

doi = "10.1109/MEMSYS.2008.4443783",

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series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "822--827",

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note = "21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson ; Conference date: 13-01-2008 Through 17-01-2008",

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Izawa, Y, Tanaka, S, Kikuchi, H, Tsurumi, Y, Miyanaga, N, Esashi, M & Fujita, M 2008, Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation. in MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems., 4443783, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 822-827, 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson, Tucson, AZ, United States, 08/1/13. https://doi.org/10.1109/MEMSYS.2008.4443783

Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation. / Izawa, Y.; Tanaka, S.; Kikuchi, H. et al.
MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 822-827 4443783 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Izawa, Y.

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AU - Miyanaga, N.

AU - Esashi, M.

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AB - We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide of separation, and the processed wafer was diced with low stress. The diced lines completely followed the internal transformation.

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Izawa Y, Tanaka S, Kikuchi H, Tsurumi Y, Miyanaga N, Esashi M et al. Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 822-827. 4443783. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2008.4443783

Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation

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