Debris-free laser-assisted low-stress dicing for multi-layered MEMS - Separation method of glass layer

Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Kikuchi, Keichi Sueda, Yoshiki Nakata, Masayoshi Esashi, Noriaki Miyanaga, Masayuki Fujita

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


We have investigated the novel debris-free in-air laser dicing technology for glass. The target wafer was a soda lime glass and a Pyrex glass with the thickness of 1 mm. Our technology combines two processes, which was a dicing guide fabrication and a wafer separation process. First process was the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The pulse width of each laser was 100 fs and 10 ns. The threshold energy for the internal transformation (NA-0.7 focusing) was 3 μJ and 65 μJ, respectively. The second process was a thermally-induced crack propagation using CO2 laser or a mechanical bending separation by pressing a blade. The internal transformation fabricated in first process worked sufficiently as the guide of separation, the dicing line completely followed the internal transformation. The diced cross-section was sharp and free from chipping. In addition, neither debris nor damages were found on the surface after laser dicing.

Original languageEnglish
Pages (from-to)91-96
Number of pages6
JournalIEEJ Transactions on Sensors and Micromachines
Issue number3
Publication statusPublished - 2008


  • Debris-free laser dicing
  • Glass
  • Internal transformation
  • MEMS
  • Noncontact wafer separation
  • Thermal stress

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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