Debris-free laser dicing for multi-layered MEMS

M. Fujita, Y. Izawa, Y. Tsurumi, S. Tanaka, H. Fukushi, K. Sueda, Y. Nakata, N. Miyanaga, M. Esashi

Research output: Contribution to conferencePaperpeer-review


A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO2 laser. The internal transformation fabricated in the first process worked well as the guide of the separation.

Original languageEnglish
Number of pages4
Publication statusPublished - 2008
Event15th International Display Workshops, IDW '08 - Niigata, Japan
Duration: 2008 Dec 32008 Dec 5


Conference15th International Display Workshops, IDW '08


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