A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO2 laser. The internal transformation fabricated in the first process worked well as the guide of the separation.
|Number of pages||4|
|Publication status||Published - 2008|
|Event||15th International Display Workshops, IDW '08 - Niigata, Japan|
Duration: 2008 Dec 3 → 2008 Dec 5
|Conference||15th International Display Workshops, IDW '08|
|Period||08/12/3 → 08/12/5|