Debris-free laser dicing for multi-layered MEMS

M. Fujita; Y. Izawa; Y. Tsurumi; S. Tanaka; H. Fukushi; K. Sueda; Y. Nakata; N. Miyanaga; M. Esashi

Debris-free laser dicing for multi-layered MEMS

M. Fujita, Y. Izawa, Y. Tsurumi, S. Tanaka, H. Fukushi, K. Sueda, Y. Nakata, N. Miyanaga, M. Esashi

ENG - Robotics

Research output: Contribution to conference › Paper › peer-review

Abstract

A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO₂ laser. The internal transformation fabricated in the first process worked well as the guide of the separation.

Original language	English
Pages	1329-1332
Number of pages	4
Publication status	Published - 2008
Event	15th International Display Workshops, IDW '08 - Niigata, Japan Duration: 2008 Dec 3 → 2008 Dec 5

Conference

Conference	15th International Display Workshops, IDW '08
Country/Territory	Japan
City	Niigata
Period	08/12/3 → 08/12/5

Cite this

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title = "Debris-free laser dicing for multi-layered MEMS",

abstract = "A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO2 laser. The internal transformation fabricated in the first process worked well as the guide of the separation.",

author = "M. Fujita and Y. Izawa and Y. Tsurumi and S. Tanaka and H. Fukushi and K. Sueda and Y. Nakata and N. Miyanaga and M. Esashi",

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note = "15th International Display Workshops, IDW '08 ; Conference date: 03-12-2008 Through 05-12-2008",

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TY - CONF

T1 - Debris-free laser dicing for multi-layered MEMS

AU - Fujita, M.

AU - Izawa, Y.

AU - Tsurumi, Y.

AU - Tanaka, S.

AU - Fukushi, H.

AU - Sueda, K.

AU - Nakata, Y.

AU - Miyanaga, N.

AU - Esashi, M.

PY - 2008

Y1 - 2008

N2 - A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO2 laser. The internal transformation fabricated in the first process worked well as the guide of the separation.

AB - A novel debris-free in-air laser dicing technology has been developed, which combines two processes: dicing guide fabrication and wafer separation. The first process is the internal transformation using a pulsed laser with high repetition rate. The second process is mechanical separation by bending stress or thermally-induced crack propagation using a CO2 laser. The internal transformation fabricated in the first process worked well as the guide of the separation.

UR - http://www.scopus.com/inward/record.url?scp=77954106028&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77954106028&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:77954106028

SP - 1329

EP - 1332

T2 - 15th International Display Workshops, IDW '08

Y2 - 3 December 2008 through 5 December 2008

ER -

Debris-free laser dicing for multi-layered MEMS

Abstract

Conference

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