We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of multi-layered MEMS as well as improves yields . Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Nd:YVO4 laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide for the separation. The diced lines completely followed the pre-fabricated internal transformation.
|Number of pages
|Published - 2008
|ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics - Temecula, CA, United States
Duration: 2008 Oct 20 → 2008 Oct 23
|ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics
|08/10/20 → 08/10/23