Debris-free low-stress high-speed laser-assisted dicing for multi-layered MEMS

Masayuki Fujita, Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Fukushi, Keiichi Sueda, Yoshiki Nakata, Masayoshi Esashi, Noriaki Miyanaga

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


We have developed a novel debris-free low-stress high-speed laser-assited dicing technology for multi-layered MEMS wafers, which generally consist of glass and Si. Our technology combines two processes: fabrication of dicing guidelines and wafer separation process. The first process is an internal transformation using a pulsed 1μm laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. We tested several pulsed lasers with different pulsewidths, including a Nd:YVO4 laser and an Yb fiber laser for generating the internal transformation in Si and/or glass. The internal transformed lines worked well as a guide of the separation. We found that internal transformation only in the Si layer was enough for dicing the glass/Si double-layered wafers. Also the thermal stress induced by the CO 2 laser was quite effective in propagating the crack inside the glass layer without internal transformation. The double-layered wafer consisting of glass and silicon can be diced with low stress by our technology.

Original languageEnglish
Pages (from-to)118-123
Number of pages6
JournalIEEJ Transactions on Sensors and Micromachines
Issue number4
Publication statusPublished - 2010


  • Debris-free laser dicing
  • Internal transformation
  • MEMS
  • Non-contact wafer separation
  • Thermal stress

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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