@inproceedings{cf5bc9cf9f0a4462be4ca020177caa17,
title = "Deep through silicon via in laser-ablated CMOS multi-project wafer for surface-mountable integrated MEMS",
author = "Yukio Suzuki and Hideki Hirano and Masanori Muroyama and Shuji Tanaka",
note = "Funding Information: Acknowledgement This study was performed in R&D Center of Excellence for Integrated Microsystems, 7RKRNX 8QLYHUVLW\ XQGHU WKH SURJUDP ³)RUPDWLRQ RI ,QQRYDWLRQ &HQWHU IRU )XVLRQ RI $GYDQFHG 7HFKQRORJLHV´ VXSSRUWHG E\ 6SHFLDO &RRUGLQDWLRQ )XQGV for Promoting Science and Technology in collaboration with the Toyota Motor Corporation and Toyota Central R&D Labs., Inc. Tohoku university was supported in part by the New Energy and Industrial Technology Development Organization (NEDO). Funding Information: This study was performed in R&D Center of Excellence for Integrated Microsystems, Tohoku University under the program {"}Formation of Innovation Center for Fusion of Advanced Technologies{"} supported by Special Coordination Funds for Promoting Science and Technology in collaboration with the Toyota Motor Corporation and Toyota Central R&D Labs., Inc. Tohoku university was supported in part by the New Energy and Industrial Technology Development Organization (NEDO).; 13th Smart Systems Integration Conference, SSI 2019 ; Conference date: 10-04-2019 Through 11-04-2019",
year = "2019",
language = "English",
series = "Smart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019",
publisher = "VDE Verlag GmbH",
pages = "177--180",
editor = "Thomas Otto",
booktitle = "Smart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019",
address = "Germany",
}