Abstract
The functional split-gate type trigate flash memory cell transistors have successfully been fabricated for the first time, and their threshold voltage (V t) variations before and after nor-mode program/erase cycle have systematically been compared with the stack-gate ones. It was experimentally found that split-gate type cell transistors with the same control gate length (L CG) of 176 nm show much smaller V t distribution after erase compared to those of stack-gate ones. Moreover, the measured source-drain breakdown voltage (BV DS) is higher than 3.1 V even the L CG was down to 76 nm. This indicates that the developed split-gate type trigate flash memory is very effective for scaled nor-type flash memory with highly suppressed over-erase.
Original language | English |
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Article number | 6145732 |
Pages (from-to) | 345-347 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 33 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2012 Mar |
Externally published | Yes |
Keywords
- Flash memory
- over-erase
- split gate
- trigate
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering