Design and early evaluation of a 3-D die stacked chip multi-vector processor

Ryusuke Egawa, Yusuke Funaya, Ryu Ichi Nagaoka, Akihiro Musa, Hiroyuki Takizawat, Hiroaki Kobayashi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Citations (Scopus)

Abstract

Modern vector processors have significant advantages over commodity-based scalar processors for memory-intensive scientific applications. However, vector processors still keep single core architecture, though chip multiprocessors (CMPs) have become the mainstream in recent processor architectures. To realize more efficient and powerful computations on a vector processor, this paper proposes a 3-D stacked chip multi-vector processor (CMVP) by combining a chip multi-vector processor architecture and the coarse-grain die stacking technology. The 3-D stacked CMVP consists of I/O layers, core layers and the vector cache layers. The I/O layer significantly improves off-chip memory bandwidth, and the vector core layer enables to install many vector cores on a die. The vector cache layer increases the capacity of on-chip memory and a high memory bandwidth to achieve the performance improvement and energy reduction by deceasing the number of off-chip memory accesses. The results of performance evaluation using real scientific and engineering applications show the potential of the 3-D stacked CMVP. Moreover, this paper clarifies that introducing the vector cache is more energy-effective than increasing the off-chip memory bandwidth to achieve the same sustained performance on the 3-D stacked CMVP.

Original languageEnglish
Title of host publicationIEEE 3D System Integration Conference 2010, 3DIC 2010
DOIs
Publication statusPublished - 2010
Event2nd IEEE International 3D System Integration Conference, 3DIC 2010 - Munich, Germany
Duration: 2010 Nov 162010 Nov 18

Publication series

NameIEEE 3D System Integration Conference 2010, 3DIC 2010

Conference

Conference2nd IEEE International 3D System Integration Conference, 3DIC 2010
Country/TerritoryGermany
CityMunich
Period10/11/1610/11/18

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