TY - GEN
T1 - Design and experiment of thermal contact sensor detecting defects on Si wafer surface
AU - Lu, Wenjian
AU - Shimizu, Yuki
AU - Ito, So
AU - Gao, Wei
PY - 2012
Y1 - 2012
N2 - A design study of a thermal-type contact sensor for the detection of small defects, the heights of which are less than 16 nm on wafer surfaces, is described in this paper. The feasibility of the contact sensor, which would detect frictional heat generated at the contact with defects, was theoretically investigated focusing on the temperature rise of the sensor element. To investigate the temperature rise of the contact sensor due to the generated frictional heat, both the theoretical calculation with a simple model of heat transfer and a simulation with a finite element model (FEM) were carried out. Relationship between the sensor size and the response of the temperature rise of the contact sensor was also investigated by using FEM simulation.
AB - A design study of a thermal-type contact sensor for the detection of small defects, the heights of which are less than 16 nm on wafer surfaces, is described in this paper. The feasibility of the contact sensor, which would detect frictional heat generated at the contact with defects, was theoretically investigated focusing on the temperature rise of the sensor element. To investigate the temperature rise of the contact sensor due to the generated frictional heat, both the theoretical calculation with a simple model of heat transfer and a simulation with a finite element model (FEM) were carried out. Relationship between the sensor size and the response of the temperature rise of the contact sensor was also investigated by using FEM simulation.
KW - Contact sensor
KW - FEM
KW - Frictional heat
KW - Wafer inspection
UR - http://www.scopus.com/inward/record.url?scp=84870615460&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84870615460&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.523-524.826
DO - 10.4028/www.scientific.net/KEM.523-524.826
M3 - Conference contribution
AN - SCOPUS:84870615460
SN - 9783037855096
T3 - Key Engineering Materials
SP - 826
EP - 831
BT - Emerging Technology in Precision Engineering XIV
PB - Trans Tech Publications Ltd
T2 - 14th International Conference on Precision Engineering, ICPE 2012
Y2 - 8 November 2012 through 10 November 2012
ER -