Design and fabrication of MEMS packaging

Masayoshi Esashi

doi:10.2493/jjspe.70.1137

Design and fabrication of MEMS packaging

Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1137-1141
Number of pages	5
Journal	Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume	70
Issue number	9
DOIs	https://doi.org/10.2493/jjspe.70.1137
Publication status	Published - 2004 Sept

Keywords

Array mems
Data storage
Electrical feedthrough
Mems
Packaging

ASJC Scopus subject areas

Mechanical Engineering

Access to Document

10.2493/jjspe.70.1137

Cite this

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title = "Design and fabrication of MEMS packaging",

keywords = "Array mems, Data storage, Electrical feedthrough, Mems, Packaging",

author = "Masayoshi Esashi",

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journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",

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publisher = "Japan Society for Precision Engineering",

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KW - Electrical feedthrough

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Design and fabrication of MEMS packaging

Keywords

ASJC Scopus subject areas

Access to Document

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