A stress sending Si chip utilizing the piezoresistive effect of Si single crystals has been developed. This chip can measure 3-dimensional stress components, σx, σy, σz and shear stress τZM in the chip surface. The stress sensitivity is 0.1 MPa in the range of-100 MPa to 100 MPa. Temperature sensors are arranged in the chip and they have linear response between-100°C and 200°C. This chip is useful for the structural design and reliability tests of IC packages. The residual stress in a chip after the die bonding process is measured using this chip. It is found that rubber paste is useful in reducing stress in that process.
|Number of pages
|Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
|Published - 1987
- Experimental Stress Analysis
- LSI Chip
- Piezoresistive Effect IC Plastic Package