TY - GEN
T1 - Development and applications of MEMS process tools
AU - Tanaka, Shuji
PY - 2015/1/1
Y1 - 2015/1/1
N2 - This paper presents our recently-developed process tools including atomic layer deposition (ALD) systems for multiple materials, a vacuum wafer bonder, a vacuum flip chip bonder for hermetic chip-scale packaging and a remote-type hot-wire atomic hydrogen source for metal reduction and polymer etching. In addition, examples of micro electro mechanical systems (MEMS) which have been created using the above tools are briefly introduced. The process tools are commercially available with customization, if necessary, via our partner company.
AB - This paper presents our recently-developed process tools including atomic layer deposition (ALD) systems for multiple materials, a vacuum wafer bonder, a vacuum flip chip bonder for hermetic chip-scale packaging and a remote-type hot-wire atomic hydrogen source for metal reduction and polymer etching. In addition, examples of micro electro mechanical systems (MEMS) which have been created using the above tools are briefly introduced. The process tools are commercially available with customization, if necessary, via our partner company.
KW - Atomic layer deposition (ALD)
KW - Flip chip bonder
KW - Hot wire reactor
KW - Wafer bonder
UR - http://www.scopus.com/inward/record.url?scp=85056474776&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85056474776&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85056474776
T3 - Proceedings of the International Display Workshops
SP - 1579
EP - 1582
BT - 22nd International Display Workshops, IDW 2015
PB - International Display Workshops
T2 - 22nd International Display Workshops, IDW 2015
Y2 - 9 December 2015 through 11 December 2015
ER -
