TY - GEN
T1 - Development and practical application of high-efficiency fire control system for the clean room
AU - Fukuda, Soji
AU - Ohmi, Tadahiro
AU - Sugawa, Shigetoshi
PY - 2006/12/1
Y1 - 2006/12/1
N2 - With the upsizing of wafers and substrates, the scale of clean room factories in the semiconductor/LCD industry is also expanding. Capital investment is as high as ¥500 billion (US$5 billion), boosting the asset value significantly. To secure a stable supply, suspension of production due to fire must never happen. The INERGEN gas fire control equipment [1], which sprays gas over the entire building to reduce the oxygen concentration to less than 15%, has been developed and installed at some universities and corporations. It is not harmful to people because there is carbon dioxide (CO2) in the gas to prevent breathing difficulties [2]. However, since the plant cost is enormous, it is suitable for relatively small facilities only. An efficient and low-cost system adopting Ar-CO2 gas has been newly developed for quickly extinguishing fires in large factories.
AB - With the upsizing of wafers and substrates, the scale of clean room factories in the semiconductor/LCD industry is also expanding. Capital investment is as high as ¥500 billion (US$5 billion), boosting the asset value significantly. To secure a stable supply, suspension of production due to fire must never happen. The INERGEN gas fire control equipment [1], which sprays gas over the entire building to reduce the oxygen concentration to less than 15%, has been developed and installed at some universities and corporations. It is not harmful to people because there is carbon dioxide (CO2) in the gas to prevent breathing difficulties [2]. However, since the plant cost is enormous, it is suitable for relatively small facilities only. An efficient and low-cost system adopting Ar-CO2 gas has been newly developed for quickly extinguishing fires in large factories.
UR - http://www.scopus.com/inward/record.url?scp=50249140696&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249140696&partnerID=8YFLogxK
U2 - 10.1109/ISSM.2006.4493073
DO - 10.1109/ISSM.2006.4493073
M3 - Conference contribution
AN - SCOPUS:50249140696
SN - 9784990413804
T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
SP - 243
EP - 246
BT - ISSM 2006 Conference Proceedings - Fifteenth International Symposium on Semiconductor Manufacturing
T2 - ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing
Y2 - 25 September 2007 through 27 September 2007
ER -