TY - GEN
T1 - Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing
AU - Kiyoyama, Koji
AU - Zhengy, Qian
AU - Hashimoto, Hiroyuki
AU - Kino, Hisashi
AU - Fukushima, Takafumi
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - This paper describes a highly parallel analog signal processing method with three-dimensional (3-D) stacked neural network chip for convolutional and deep neural networks (CNNs and DNNs). The proposed chip has a stacked structure, which enables highly parallel mixed-signal operations like human brains with low power consumption. The product-sum operation using analog circuit in highly parallel calculation with low power supply current, but repeated calculations result in excessive noise (e.g.The offset voltage of the amplifier and 1/f noise, kT/C noise etc.) accumulation and degraded calculation accuracy. Therefore, analog signal processing with 3-D stacked multiple layers neural network chip require the noise reduction technique. In this design, correlated double sampling (CDS) is used to noise reduction technique with which reduce noise generated in the circuit. The proposed CDS circuit is designed with CMOS 0.18nm technology. As results of simulation analysis, it was confirmed that the CDS circuit reduced the offset voltage of composing amplifier and the noise voltages of the circuits placed before the CDS circuit to less than 1.25mV.
AB - This paper describes a highly parallel analog signal processing method with three-dimensional (3-D) stacked neural network chip for convolutional and deep neural networks (CNNs and DNNs). The proposed chip has a stacked structure, which enables highly parallel mixed-signal operations like human brains with low power consumption. The product-sum operation using analog circuit in highly parallel calculation with low power supply current, but repeated calculations result in excessive noise (e.g.The offset voltage of the amplifier and 1/f noise, kT/C noise etc.) accumulation and degraded calculation accuracy. Therefore, analog signal processing with 3-D stacked multiple layers neural network chip require the noise reduction technique. In this design, correlated double sampling (CDS) is used to noise reduction technique with which reduce noise generated in the circuit. The proposed CDS circuit is designed with CMOS 0.18nm technology. As results of simulation analysis, it was confirmed that the CDS circuit reduced the offset voltage of composing amplifier and the noise voltages of the circuits placed before the CDS circuit to less than 1.25mV.
KW - AI chip
KW - analog product-sum signal processing
KW - correlated double sampling (CDS)
KW - deep neural network (DNN)
KW - in-memory computing NN
KW - machine leaning
KW - near-memory computing NN
KW - neural network (NN)
KW - noise reduction technique
KW - stacked Neuron Chip
UR - http://www.scopus.com/inward/record.url?scp=85084109529&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85084109529&partnerID=8YFLogxK
U2 - 10.1109/3DIC48104.2019.9058856
DO - 10.1109/3DIC48104.2019.9058856
M3 - Conference contribution
AN - SCOPUS:85084109529
T3 - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
BT - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Y2 - 8 October 2019 through 10 October 2019
ER -