Abstract
A specimen-cooling device has been designed, manufactured and integrated into a commercial ion-milling instrument for transmission electron microscopy. The instrument enables us to prepare section specimens of tin-plated Cu without forming intermetallic compound particles and/or voids. The results show that cooling of specimen during ion-milling process is necessary for fine structure investigations of low melting temperature materials.
Original language | English |
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Pages (from-to) | 25-27 |
Number of pages | 3 |
Journal | Journal of Electron Microscopy |
Volume | 60 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2011 Feb |
Keywords
- cooling stage
- ion-milling
- Sn-plating