Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Takafumi Fukushima; Eiji Iwata; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/3DIC.2009.5306524

Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

Original language	English
Title of host publication	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs	https://doi.org/10.1109/3DIC.2009.5306524
Publication status	Published - 2009 Dec 1
Event	2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States Duration: 2009 Sept 28 → 2009 Sept 30

Publication series

Name	2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Country/Territory	United States
City	San Francisco, CA
Period	09/9/28 → 09/9/30

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/3DIC.2009.5306524

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Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. / Fukushima, Takafumi; Iwata, Eiji; Tanaka, Tetsu et al.

2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009. 5306524 (2009 IEEE International Conference on 3D System Integration, 3DIC 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fukushima, T, Iwata, E, Tanaka, T & Koyanagi, M 2009, Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. in 2009 IEEE International Conference on 3D System Integration, 3DIC 2009., 5306524, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, CA, United States, 09/9/28. https://doi.org/10.1109/3DIC.2009.5306524

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abstract = "We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.",

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N2 - We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

AB - We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

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Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Abstract

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