Abstract
A ductile machining system based on the straight-line enveloping method is developed for fabricating convex axisymmetric aspheric surfaces on hard brittle materials. This system enables thinning of undeformed chip thickness in the nanometric range by using a straight-nosed diamond tool on an X-Z-B 3-axis ultraprecision machine tool, capable for simultaneous numerical control. The configuration of the system and the cutting tests for a large-scale single-crystal silicon aspheric lens are described. The results indicate that the developed system improves production efficiency and tool life significantly, compared to the conventional method.
| Original language | English |
|---|---|
| Pages (from-to) | 43-48 |
| Number of pages | 6 |
| Journal | Key Engineering Materials |
| Volume | 238-239 |
| Publication status | Published - 2003 Jan 1 |
Keywords
- Aspheric surface
- Brittle material
- Diamond turning
- Ductile machining
- Optics
- Silicon
- Ultra-precision cutting
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering