Development of an automated vapor/liquid hybrid deposition system to form high-k dielectrics

Daisuke Hojo, Yi Xuan, Tetsuji Yasuda

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


Vapor/liquid hybrid deposition (VALID) is a modified atomic layer deposition (ALD) method that combines adsorption of metal precursors from the vapor phase with their hydrolysis from the liquid phase. This paper is a report of the development of an automated VALID apparatus that performs the adsorption/hydrolysis processes with a reasonable throughput. HfO2 films have been successfully produced with this automated system using Hf(O′C4H9)4 [hafnium tetra-fert-butoxide (HTB)]as the precursor. A brief discussion is given on the contribution of multilayer adsorption of HTB to the observed deposition rates.

Original languageEnglish
Pages (from-to)214-219
Number of pages6
JournalChemical Vapor Deposition
Issue number4
Publication statusPublished - 2006 Apr 1


  • Adsorption
  • Atomic layer deposition
  • High-k dielectrics
  • Hydrolysis
  • Vapor/liquid hybrids

ASJC Scopus subject areas

  • Electrochemistry
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials


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