TY - JOUR
T1 - Development of Bi-base high-temperature Pb-free solders with second-phase dispersion
T2 - Thermodynamic calculation, microstructure, and interfacial reaction
AU - Takaku, Yoshikazu
AU - Ohnuma, Ikuo
AU - Kainuma, Ryosuke
AU - Yamada, Yasushi
AU - Yagi, Yuji
AU - Nishibe, Yuji
AU - Ishida, Kiyohito
N1 - Funding Information:
The support from CREST, Japan Science and Technology Agency, NEDO, New Energy Development Organization, and the Hosokawa Power Technology Foundation is acknowledged.
PY - 2006/11
Y1 - 2006/11
N2 - Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573-583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X = Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.
AB - Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573-583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X = Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.
KW - ADAMIS (alloy database for micro-solders)
KW - CALPHAD
KW - Fine dispersed particles
KW - High-temperature solder
KW - Pb-free solder
KW - Phase diagram
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U2 - 10.1007/s11664-006-0295-6
DO - 10.1007/s11664-006-0295-6
M3 - Article
AN - SCOPUS:33845736010
SN - 0361-5235
VL - 35
SP - 1926
EP - 1932
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 11
ER -