Development of heat resistant Pb-free joints by TLPS process of ag and Sn-Bi-Ag alloy powders

I. Ohnuma, R. Kainuma, K. Ishida

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12 Citations (Scopus)


TLPS (Transient Liquid Phase Sintering) process is a candidate method for heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of a heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with a liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the ε-Ag3Sn-IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consisted of the Ag3Sn-IMC and Bi-rich phases, both of which started melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heat-resistant bonding.

Original languageEnglish
Pages (from-to)413-418
Number of pages6
JournalJournal of Mining and Metallurgy, Section B: Metallurgy
Issue number3
Publication statusPublished - 2012


  • High-tepmerature Pb-free solder
  • Transient liquid phase sintering (TLPS)


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