TY - GEN
T1 - Development of Mechanically-Robust Piezoelectric Micromachined Ultrasonic Transducer (pMUT) with Island-Shaped PZT Monocrystalline Thin Film
AU - Thao, Pham N.
AU - Yoshida, Shinya
AU - Tanaka, Shuji
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - In this study, we developed a mechanically-robust piezoelectric micromachined ultrasonic transducer (pMUT) based on a monocrystalline Pb(Zr, Ti)O3 thin film (Mono-PZT). Mono-PZT has a high value of figure of merit (FOM) for pMUT. However, the mechanical fracture is often caused for a conventional-design pMUT during the resonant driving with a large displacement. That is perhaps due to its brittle property. For overcoming this problem, we proposed a new design: island-shaped Mono-PZT structure covered with a ring-shaped polyimide thin film. The fracture test proved that this design is effective for enhancing the mechanical robustness. This achievement has a great potential to create not only a higher-performance but also highly-reliable pMUT.
AB - In this study, we developed a mechanically-robust piezoelectric micromachined ultrasonic transducer (pMUT) based on a monocrystalline Pb(Zr, Ti)O3 thin film (Mono-PZT). Mono-PZT has a high value of figure of merit (FOM) for pMUT. However, the mechanical fracture is often caused for a conventional-design pMUT during the resonant driving with a large displacement. That is perhaps due to its brittle property. For overcoming this problem, we proposed a new design: island-shaped Mono-PZT structure covered with a ring-shaped polyimide thin film. The fracture test proved that this design is effective for enhancing the mechanical robustness. This achievement has a great potential to create not only a higher-performance but also highly-reliable pMUT.
KW - mechanical robustness
KW - monocrystalline thin film PZT
KW - pMUT
UR - http://www.scopus.com/inward/record.url?scp=85071951486&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071951486&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2019.8808654
DO - 10.1109/TRANSDUCERS.2019.8808654
M3 - Conference contribution
AN - SCOPUS:85071951486
T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
SP - 833
EP - 836
BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Y2 - 23 June 2019 through 27 June 2019
ER -